| Chapter 1 Executive Summary |
|
| Market Overview |
1-1 |
| Introduction |
1-1 |
| Market Definitions |
1-2 |
| Market Definitions |
1-2 |
| Wire Bonding |
1-2 |
| Wafer Bumping |
1-2 |
| Packaging |
1-3 |
| Major Research Findings |
1-4 |
| Semiconductor Opportunities for SMT Equipment Manufacturers |
1-4 |
| Semiconductor Market Focus |
1-5 |
| Semiconductor Packaging and Test Service Providers |
1-6 |
| |
|
| Chapter 2 Total SMT Opportunities in Back-end Markets |
|
| Market Dynamics |
2-1 |
| SMT and Back-end Semiconductor Package Assembly Processes |
2-1 |
| Basic Steps in the SMT PCB Production Chain: |
2-1 |
| Basic Steps in Back-end Semiconductor Package Assembly: |
2-2 |
| Wire Bonding and Flip Chip Processes |
2-2 |
| Steps Involved in Wire Bonding Chip onto the Substrate: |
2-2 |
| Steps Involved in Flip Chip Bumping onto the Substrate: |
2-3 |
| Merits of wire bonding |
2-3 |
| Merits of flip chip bumping |
2-3 |
| Industry Challenges |
2-4 |
| Convincing the Semiconductor End Users to Employ SMT Equipment is a Challenge |
2-5 |
| Fluctuations in the Demand for Lead-free and High-lead Reflow Ovens for |
|
| Back-end Markets Challenge Market Presence |
2-5 |
| The Challenge is to Develop In-line Automated Optical Inspection (AOI) Systems That Can Monitor the Quality of Die Attach Process |
2-6 |
| Addressing the Move Towards Finer Interconnect Pitches for Advanced Packaging is a Challenge for Screen Printer Markets |
2-6 |
| Lack of Complete Back-end Semiconductor Market Knowledge Challenges SMT Market Participants from Catering Back-end Markets |
2-7 |
| The Growing Need for Multi-featured Dispensing Equipment That Can Perform Key Functions in Addition to Dispensing is a Challenge |
2-7 |
| The Challenge is to Improve Speed Continuously by Maintaining High Accuracy Levels |
2-8 |
| Offering Cost-effective Integrated Solutions to Cater Back-end Markets is a |
|
| Challenge for SMT Market Participants |
2-8 |
| Market Drivers |
2-9 |
| Advanced Packaging Trends Strengthen the Use of X-ray Inspection Equipment |
2-9 |
| Complexities in Rework and Repair Compels the Use of Inspection Equipment, Driving their Growth |
2-10 |
| Wafer Bumping Has Opened Up Opportunities for SMT Screen Printers |
2-10 |
| 3D Inspection of the Solder Ball Process is a Driver for the SMT Market Participants |
2-11 |
| Market Restraints |
2-11 |
| Trade-off between High Accuracies and High Speeds Deter SMT Placement Equipment from Catering to Back-end Semiconductor Markets |
2-12 |
| Varying Manufacturing Technology and Mechanical Structures of SMT Equipment Curb Them from Serving Backend Semiconductor Markets |
2-12 |
| Need for Custom-based Inspection Systems Affect Equipment |
|
| Manufacturers Developing Separate AOI Equipment |
2-13 |
| SMT Equipment Opportunity Analysis |
2-13 |
| SMT Pick and Place Equipment |
2-13 |
| SMT Inspection Equipment |
2-13 |
| SMT Soldering Equipment |
2-14 |
| SMT Screen Printer |
2-15 |
| SMT Glue Dispenser |
2-15 |
| SMT Equipment for catering semiconductor die and flip chip bonding markets |
2-15 |
| Competitive Structure |
2-18 |
| Number of Companies in the Market |
2-18 |
| Types of Competitors |
2-18 |
| Distribution Structure |
2-19 |
| Tiers of Competition |
2-19 |
| Key Competitive Factors |
2-19 |
| |
|
| Chapter 3 Strategic Analysis of SMT Opportunities in Wafer Bumping and Back-end Packaging |
|
| Forecasts and Trends |
3-1 |
| Die Attach Equipment Trends |
3-1 |
| Advanced Electronic Packaging Trends |
3-2 |
| Wafer Bumping- Trends & Applications |
3-4 |
| Wafer Bumping Applications |
3-6 |
| |
|
| Chapter 4 Appendix |
|
| Decision Support Database (DSD) Tables |
4-1 |
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