| Chapter 1 Executive Summary |
|
| Market Overview |
1-1 |
| Introduction to Semiconductor Packaging Market |
1-1 |
| Market Definition and Segmentation |
1-2 |
| Definition |
1-3 |
| Summary of Major Findings |
1-4 |
| Growth Opportunities and Total Market Forecasts |
1-4 |
| Key Technology Trends in the Semiconductor Packaging Market |
1-5 |
| |
|
| Chapter 2 Market Overview of the Southeast Asian Semiconductor Packaging Markets |
|
| Industry Evolution |
2-1 |
| Semiconductor Packaging Market Overview |
2-1 |
| Industry Scenario |
2-2 |
| Salient Features of the Market |
2-2 |
| Market Segmentation by Semiconductor Packaging Technologies |
2-3 |
| Business Strategies |
2-6 |
| Business Strategies of Leading Companies |
2-6 |
| |
|
| Chapter 3 Technology Trends in the Emerging Southeast Asian Semiconductor Packaging Markets |
|
| Emerging Trends in the Semiconductor Packaging Technology Markets |
3-1 |
| Current and Emerging Technology Trends in the Semiconductor Packaging Market |
3-1 |
| Growth Pattern of Different Packages |
3-3 |
| |
|
| Chapter 4 Revenue Forecasts for the Southeast Asian Semiconductor Packaging Markets |
|
| Overall Revenue Forecasts of Southeast Asian Semiconductor Packaging Markets |
4-1 |
| Total Market Revenue Forecasts |
4-1 |
| Revenue Forecasts for Semiconductor Packaging Technologies |
4-4 |
| Revenue Forecasts for the Ball Grid Array (BGA) Market |
4-4 |
| Revenue Forecasts for the Pin Grid Array (PGA) Market |
4-6 |
| Revenue Forecasts for the Small Outline Packages (SOP) Market |
4-8 |
| Revenue Forecasts for the Inline Packages (IP) Market |
4-10 |
| Revenue Forecasts for the Quad Flat Package (QFP) Market |
4-12 |
| Revenue Forecasts for the Chip Scale Package (CSP) Market |
4-14 |
| |
|
| Chapter 5 Market Analysis of the Southeast Asian Semiconductor Packaging Markets |
|
| Assessment of Market Dynamics |
5-1 |
| Challenges Faced by Emerging Technologies |
5-1 |
| Higher Performance, Functionalities and Miniaturization of Products Challenge Performance of Packages |
5-2 |
| Increase in Investments due to Technological Upgradation |
5-2 |
| Rising Demand for Green/Environment-friendly IC Packaging Poses Demand for Better Packaging Materials |
5-3 |
| Faster Time to Market Demands Faster Technological Upgradation |
5-3 |
| Increasing Material Prices Challenge the Packaging Market |
5-3 |
| Concerns Regarding Reliability of New Technologies |
5-3 |
| Lack of Standardization Due to Extensive Customization of Products |
5-4 |
| Hesitancy Among Electronics Manufacturers to Deploy Advanced Packaging Technologies |
5-4 |
| Need for Improved Infrastructure for Manufacturing Advanced Technologies such as Flip Chip Poses A Challenge to the Industry |
5-4 |
| Market Drivers |
5-5 |
| Miniaturization of Products in the Semiconductor Market Drives Demand for Advanced Packages |
5-5 |
| Growth in Outsourcing Drives the Market for Semiconductor Packaging in Southeast Asia |
5-6 |
| Product Developments and Technological Changes in Various Application Markets Spur Demand for High-performance Chips |
5-6 |
| Greater Complexity in Products Leads to Increasing Demand for Higher Speed in Chips, Thus Spurring Demand for Advanced Packaging Technologies |
5-6 |
| Improved Performance of Advanced Packages Over Peripherally Leaded Ones Drives Growth of Advanced Packaging Technologies |
5-7 |
| Increase in Foreign Investments in Southeast Asia Drives Growth in Semiconductor Packaging Market |
5-7 |
| Market Restraints |
5-7 |
| Large Capital Investments for New Packaging Technologies Discourage Their Use |
5-8 |
| Declining Packaging Prices Reduce Profits and Market Revenues |
5-8 |
| Slow Pace of Technology Acceptance |
5-8 |
| Lack of Industry Infrastructure Limits Growth Potential of Emerging Packages |
5-9 |
| SWOT Analysis of Semiconductor Packaging Market in Southeast Asia |
5-9 |
| Market Strengths |
5-9 |
| Market Weaknesses |
5-11 |
| Market Opportunities |
5-11 |
| Market Threats |
5-11 |
| |
|
| Chapter 6 Competitive Analysis of the Southeast Asian Semiconductor Packaging Markets |
|
| Competitive Structure |
6-1 |
| Competitors in Southeast Asian Semiconductor Packaging Market |
6-1 |
| Distribution Structure |
6-3 |
| Tiers of Competition |
6-3 |
| Key End-user Groups |
6-3 |
| Competitive Analysis |
6-5 |
| Market Share Analysis |
6-5 |
| Key Competitive Factors |
6-8 |
| |
|
| Chapter 7 Future Trends in Southeast Asian Semiconductor Packaging Markets |
|
| Semiconductor Packaging Market |
7-1 |
| Packaging Trends |
7-1 |
| |
|
| Chapter 8 Strategic Recommendations for the Southeast Asian Semiconductor Packaging Markets |
|
| Strategic Recommendations |
8-1 |
| Create Standards for Packages |
8-1 |
| Mergers and Alliances |
8-2 |
| Fund Research and Development |
8-2 |
| Achieve Faster Market Delivery |
8-2 |
| Target the Correct End-user Markets |
8-3 |
| |
|
| Chapter 9 Database of Key Industry Participants |
|
| Key Industry Participants of the Southeast Asian Semiconductor Packaging Markets |
9-1 |
| List of Companies |
9-1 |
| Malaysia |
9-1 |
| Singapore |
9-2 |
| The Philippines |
9-3 |
| Thailand |
9-4 |
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