World Smart Card IC Market（全球IC智能卡市场）

Chapter 1 Executive Summary
Introduction	1-1
Executive Summary	1-1

Chapter 2 Factors Impacting the Market
Market Overview	2-1
Introduction to the Smart Card IC Market	2-1
Market Drivers	2-2
Government and Identification Projects Hold Huge Promise	2-2
Concern Over Safety for Citizens and Information Injects Promotes Market Growth	2-3
Europay, MasterCard, VISA (EMV) Continues to Drive Growth	2-3
E-passports Offer High Volume and Value Growth in the Short-Medium Term	2-3
SIM Cards Continue to Dominate the Market	2-4
Developments in the US Spark the Use of Biometrics in E-passport	2-4
The Emergence of China as the Largest Smart Card Market is a Major Driving Factor	2-4
Contactless Banking Promises Great Opportunities	2-5
Mega-SIM, MMC, Memory Storage Cards and Flash Cards all Await on the Horizon	2-5
Market Restraints	2-6
Intense Price Pressure Causes Grave Concern for Chip Participants	2-6
More Success Stories Needed Quickly	2-6
The Value Chain Rocks Causing Uncertainty	2-7
Challenges of Successful E-Passports could Dampen the Market	2-7
Knock on Effect as the Card Market Faces a Price Slump	2-7
Type of IC	2-8
Total Market—Memory Versus Microcontroller	2-8
Memory IC Market	2-11
Microcontroller IC Market	2-13

Chapter 3 Total Market Analysis
Market Analysis	3-1
Total Market	3-1
Regional Split	3-3

Chapter 4 The EMEA Market
Market Analysis	4-1
Introduction	4-1
Market Drivers	4-2
EMV Continues to Offer Volume Growth	4-2
Contactless Technology Continues to Provide Glimpses of Promise	4-3
Changes in the Value Chain Could Benefit Semiconductor Manufacturers	4-3
Near Field Communication (NFC) Reader to Reader Technology
Extends Contactless Technology to the Next Level Giving the Market Huge Potential	4-3
Market Restraints	4-4
Pricing Pressures Squeeze Vendors	4-4
SIM Cards Face Stiff Competition from Flash Cards	4-4
Value Added Offerings Cause a Shift in the Value Chain and Provides Uncertainty for Future Relationships	4-5
Trends and Forecasts	4-5
High Speed SIMs Evenly Split the Market	4-15

Chapter 5 The APAC Market
Market Analysis	5-1
Introduction	5-1
Market Drivers	5-2
EMV Migration for Payment Cards Still in the Growth Stage	5-2
India on the Verge of Larger Rollouts	5-3
Larger Memory Chips Gaining Ground	5-3
Ongoing 3G Migration Continues in Asia Pacific	5-4
Market Restraints	5-4
Low Affordability in Developing Countries	5-4
Challenges Faced by National ID Cards	5-5
Lack of Innovation in Smart Card IC Manufacturers Chips in China	5-5
Trends and Forecasts	5-5
Transit Cards Moving Beyond Fare Collection	5-14
China's IC chip Participants Challenged by Global Participants	5-14

Chapter 6 The Americas Market
The North American Market	6-1
Introduction	6-1
Market Drivers	6-1
Contactless Payment Pilot Advances to Nationwide Rollout	6-2
Cost Benefit of Single Access Card Solution Promoted	6-2
Homeland Security Mandates to Hike Demand in Public and Private Sector	6-2
Federal Banking Guidelines Favor Smart Card Technology Implementation	6-3
Market Restraints	6-3
Consumer Phobia of New Technology to Impact Contactless Acceptance	6-3
Government's Delay in Defining Product Specifications Stalling Rollout	6-3
Lack of Security Industry Standards Limit Integration of Smart Cards	6-4
Trends and Challenges	6-4
Challenges	6-4
New Market Opportunities	6-4
The Latin American Market	6-5
Introduction	6-5
Market Drivers	6-6
SIM Platform Continues to Drive Revenue Growth Rates	6-7
Public Transport Operators Increase Adoption of Smart Card Technology	6-7
Government ID Promises Progressive Massive Adoption	6-7
EMV Migration Expands Demand Through Several Latin American Countries	6-8
Market Restraints	6-9
Smart Cards and Infrastructure High Costs Increase Pricing Pressures	6-9
Lack of Business Case for Smart Card Adoption and Upcoming Presidential Elections Retain IC Demand	6-10
GSM Market Saturation Threatens Main Market Participants	6-10
Market Trends	6-10
Low End ICs Promise Massive Implementation	6-10
No International Mandate Pins Down E-passports' Adoption	6-11
Market Analysis	6-11
Market Forecasts	6-11

Chapter 7 Competitive Analysis
Overall Global Perspective	7-1
State of the Competitive Landscape	7-1
China's IC Chip Players Challenged by Global Players	7-1
Global Performances	7-2
Regional Performances	7-8
Supply Chain Developments in North America	7-15
Further Breakdown	7-16
Memory IC versus Microcontroller IC	7-16
Individual Company Performance	7-24
Infineon	7-24
Atmel	7-28
Samsung	7-32
Renesas	7-35
Philips Semiconductors	7-38
STMicroelectronics	7-42
SST (Emosyn)	7-46
Others	7-47
Sony	7-50
SmartCode Corporation	7-50
Sharp	7-50
Inside Contactless	7-51
Texas Instruments	7-51
Fujitsu	7-51
Malaysia Microelectronic Solutions (My-MS)	7-51
China Participants	7-52
Smart Card Design Houses	7-52
Datang Microelectronics Technology Co. Ltd.	7-52
Shanghai Fudan Microelectronics Co. , Ltd.	7-52
CEC Huada Electronics Design Co. , Ltd (HED)	7-53
Shanghai Hua Hong Microelectronics Co. Ltd.	7-53
Tsinghua Tongfang Microelectronics Co., Ltd.	7-53
Smart Card IC and Wafer Manufacturers	7-54
Shanghai Hua Hong NEC Electronics Co. , Ltd.	7-54
Shanghai Advanced Semiconductor Manufacturing Corp. Ltd. (ASMC)	7-54
Shanghai Belling Corp. Ltd	7-54
Smart Card IC Module and Packaging and Testing	7-55
Shanghai Chang Feng Smart Card Co., Ltd	7-55
Shanghai Eternal Information Technology Co. Ltd.	7-55
Historic Market Shares	7-55
Infineon	7-55
Infineon	7-56
Atmel	7-59
Samsung	7-62
Renesas	7-63
Philips Semiconductors	7-64
STMicroelectronics	7-67
Others	7-70
Total Smart Card IC Historic Market Shares	7-73
Units—Total Market	7-73
Revenues—Total Market	7-77
Individual Regional Performances	7-81
Infineon	7-81
Atmel	7-82
Samsung	7-83
Renesas	7-84
STMicroelectronics	7-85
Philips Semiconductors	7-87

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